Plating device Rectifier
Best solution for ultra-thin films and ultra-precision plating.
Plating Equipment Rectifier Development and Adoption of High Frequency Pulse Module
- Company：トリコ 東京支店
- Price：Other
Plating Equipment Product List and Ranking from 8 Manufacturers, Suppliers and Companies
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
Plating Equipment Manufacturer, Suppliers and Company Rankings
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
- テクニックジャパン 横浜実験室 Kanagawa//Resin/Plastic
- トーア電子 Aichi//Electronic Components and Semiconductors
- トリコ 東京支店 Tokyo//Industrial Electrical Equipment
- 4 SETO ENGINEERING 守谷事業所 Ibaraki//Industrial Machinery
- 4 ハープ Osaka//Industrial Machinery
Plating Equipment Product ranking
Last Updated： Aggregation Period:Sep 24, 2025～Oct 21, 2025
This ranking is based on the number of page views on our site.
- Introduction to Toa Electronics' Wet Process Business トーア電子
- Plating equipment SBE (jet-type) plating equipment テクニックジャパン 横浜実験室
- Plating device Rectifier トリコ 東京支店
- Plating device "TPM1000 exterior solder plating device" テクニックジャパン 横浜実験室
- 4 Plating device "Pattern plating device" テクニックジャパン 横浜実験室
Plating Equipment Product List
1～13 item / All 13 items
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Plating device "TPM1000 exterior solder plating device"
Due to the low variation in plating thickness and high reproducibility of the plating, inspections can be significantly reduced.
The plating device "TPM1000 exterior solder plating device" processes the lower end of a stainless steel belt into a wedge-shaped spring, allowing for the vertical loading of strip lead frames while simultaneously enabling horizontal transport and power supply. The development of this horizontal transport method has significantly improved the plating quality of strip lead frames, making it the global standard method. Inline deburring with high-pressure water is also possible. For more details, please contact us.
- Company：テクニックジャパン 横浜実験室
- Price：Other
Plating device "Pattern plating device"
The advanced pattern plating equipment of the technique sets the industry standard.
The plating device "Pattern Plating Device" achieves a uniform plating layer even in high aspect ratio holes. The panel positioning system ensures that the positions of the panel and anode are kept horizontal during stirring. Our large-scale plating systems have a throughput of over 50-100 panels per hour. We manufacture chemicals for all processes involved in substrate plating and cater to all needs from equipment to chemicals. For more details, please contact us.
- Company：テクニックジャパン 横浜実験室
- Price：Other
Plating equipment "MP80 terminal plating device"
Numerous installation achievements. It is possible to reduce the amount of gold used by equalizing the plating thickness.
The plating device "MP80 terminal plating device" enables the reduction of gold usage through the uniformity of plating thickness. The technique boasts the largest installation record in the world for terminal plating devices. You can choose from a variety ranging from the Mini FFP with a processing speed of 0.45m per minute and a footprint of 3.3m x 0.9m to the MP80 with a speed of 3.6m per minute. Based on the largest number of installations in the world, we provide systems and support tailored to your company's needs. Please contact us for more details.
- Company：テクニックジャパン 横浜実験室
- Price：Other
Introduction to Toa Electronics' Wet Process Business
Technological capabilities that contribute to the development and practical application of advanced materials.
We propose a surface treatment device that condenses our unique manufacturing technology. In recent years, with the increasing complexity of three major types of circuits—flexible printed circuits (FPC), rigid printed circuits, and packages—we handle various surface treatment devices such as plating equipment, developing, etching, and stripping equipment (DES), and cleaning devices that respond to the trends of high density and miniaturization. We take full responsibility for the design, manufacturing, assembly, construction, and maintenance of various devices.
- Company：トーア電子
- Price：Other
Repair and improvement services for mechanical devices *Case studies available for problem-solving
Isn't it the case that the manufacturer who made the machine is far away, making it impossible to repair it quickly?
Do you have concerns like, 'The manufacturer who made the machine is in the Kanto region, and it takes time to get them to come for repairs...'? Our company, based in Osaka, can quickly resolve such issues. Additionally, when it comes to repairing machines, if the manufacturer has outsourced the electrical control, it can take even longer. You may have experienced situations where you couldn't reach the person in charge of electrical control and ended up with a whole day of downtime. At Kami Kiko, we possess not only the know-how for 'machines' but also the expertise in 'electrical control,' allowing us to respond swiftly and accurately even in such situations. *For more details, please refer to the PDF document or feel free to contact us.
- Company：加美機工
- Price：Other
Plating device "PEN-MEKKI MINI"
The liquid and pen are different types! Suitable for pinpoint plating and partial plating after repairs.
The "PEN-MEKKI MINI" is a pencil-type plating device. Since the liquid and the plating pen are separate, you can use only the necessary amount of liquid, making it economical and waste-free. It is also very useful for repairs and sample creation as it can be done in a short time. Additionally, when changing the plating liquid, you only need to replace the pen tip. The fine tip allows for use on complex items and even on neck chains. 【Features】 ■ Easy and clean partial plating ■ The liquid and plating pen are separate, allowing for economical use of only the necessary amount of liquid ■ Very useful for repairs and sample creation as it can be done in a short time ■ Simply replace the pen tip when changing the plating liquid ■ Suitable for partial plating after repairs with a laser welder *For more details, please refer to the PDF document or feel free to contact us.
- Company：花山産業
- Price：Other
Plating equipment SBE (jet-type) plating equipment
A completely new concept for a rotating plating device that replaces barrels.
A completely new concept of a rotary plating device developed by Technique Corporation, which replaces barrels.
- Company：テクニックジャパン 横浜実験室
- Price：Other
Plating device
At SETO ENGINEERING, we specialize in the design and manufacturing of various types of plating equipment, utilizing roll-to-roll technology!
As a technology group specialized in roll-to-roll manufacturing equipment, SETO ENGINEERING Co., Ltd. has been reformed with the main technical staff from the former Seto Giken Kogyo Co., Ltd. In the future, we will operate as a group of specialists in roll-to-roll manufacturing equipment. Among our strengths is the design and manufacturing of "plating equipment." We utilize roll-to-roll manufacturing technology to accommodate various types of plating. 【Manufactured Equipment Achievements】 ● Melting Copper Plating Equipment This equipment can perform electrolytic copper plating on blind vias and through holes. The material thickness ranges from PI 25μm and the material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. ● Electrolytic Copper Plating Equipment (Non-Melting Copper Plating) Copper plating can be applied to the product pattern sections. The process includes pre-treatment of the film foil, copper plating, rinsing, and drying, conducted in a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the equipment, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). Basic information on other types of plating equipment is provided.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
Plating device "Chibi Plating"
A simple operation specialized for one ring! The definitive small plating device!
"Chibi Meki" is a compact plating device designed for simple operation, specifically for plating one ring. It is pre-set to the current value suitable for one ring, so there is no need to adjust the current during use. The liquid temperature is electronically controlled to be optimal for rhodium plating solution. 【Features】 ■ Specialized for one ring (pre-set to the current value for one ring) ■ Simple operation compact plating device ■ No current adjustment needed ■ Electronically controlled to the optimal liquid temperature for rhodium plating solution Videos are available on the Harp website. *For more details, please refer to the PDF document or feel free to contact us.
- Company：ハープ
- Price：Other
Plating device "Plating Basic"
Pursuing ease of use and compactness! Adopting a constant current control circuit eliminates the need for current density adjustment!
The "Mekki Basic" is a plating device that improves workability by adopting a constant current control circuit, eliminating the need for cumbersome current density adjustments. It maintains the plating solution at an appropriate temperature using a heater installed in the plating tank. The temperature can be selected from 45°C and 55°C, allowing for flexible operation tailored to the plating solution. We also offer a compact plating device called "Chibi Mekki," which is specifically designed for plating a single ring with simple operation. 【Features】 ■ Adoption of constant current control circuit ■ No need for current density adjustments ■ Maintains plating solution at an appropriate temperature with a heater installed in the plating tank ■ Selectable between 45°C and 55°C *For more details, please refer to the PDF document or feel free to contact us.
- Company：ハープ
- Price：Other
Plating device "Light TERI Shine MM-10"
This one machine is good for electrolysis, degreasing, and plating!
The "Hikari TERI Radiance MM-10" is a compact plating device that can be installed in a small space. By using the optional plating pen, it is also capable of partial plating. Additionally, it allows for plating processing in a short time, contributing to repairs and sample creation. 【Features】 ■ Partial plating is possible with the optional plating pen ■ Easy to use, clean, and convenient ■ Useful for repairs and sample creation due to quick processing ■ Beaker size can be changed from 300ml to 500ml with options ■ Requires a small amount of plating solution, reducing waste *For more details, please download the PDF or feel free to contact us.
- Company：花山産業
- Price：Other
Equipment, ancillary devices, construction
We create inspection equipment and more from scratch based on your proposals! We fully support your desires related to manufacturing.
At YKC Corporation, we provide a comprehensive service for "equipment, ancillary devices, and construction," including the selection and installation of factory exhaust ducts and scrubbers. We also offer custom proposals for inspection devices tailored to your products, supporting your manufacturing needs with full commitment to your "wants." We respond to diverse needs, so please feel free to contact us when you require our services. 【Features】 ■ Comprehensive support from the selection of factory exhaust ducts and scrubbers to installation ■ Custom proposals for inspection devices tailored to your products ■ Full support for your manufacturing desires *For more details, please refer to the PDF document or feel free to contact us.
- Company：ワイケイシー
- Price：Other
